[1]Cong P Z, Zhang X, Fujii M. Estimation of thermal contact resistance using ultrasonic waves [J]. Thermophys, 2006, 27: 171-183. [2]吴登倍. 接触热阻实验与数值模拟[D]. 北京:北京交通大学, 2011.Wu D B. Experiment and Numerical Simulation of Thermal Contact Resistance [D]. Beijing: Beijing Jiaotong University, 2011. [3]Thomas T R, Probert S D. Thermal contact resistance: The directional effect and other problems [J]. HeatMass Transfer, 1970, 13(5): 789-807. [4]Mcwaid T H, Marschall E. Thermal contact resistance across pressed metal contacts in a vacuum environment [J]. Heat Mass Transfer, 1992, 28(11): 2911-2920. [5]Lahmar A, Nguycn T P,Sakami D. Experimental investigation on the thermal contact resistance between gold coating and ceramic substrates [J]. Thin Solid Films, 2001, 389: 167-172. [6]Shi L, Wang H L. Investigation on thermal contact resistance by photothermal technique at low temperature [J]. HeatMass Tran sfer, 2007, 43(11): 1179-1184. [7]Lange K. Handbook of Metal Forming [M].New York: McGraw Hill, 1985. [8]Madhusudana C V. Thermal Contact Conductance [M]. Berlin: Springer, 1996. [9]应济,贾昱,陈子辰,等.粗糙表面接触热阻的理论和实验研究[J].浙江大学学报:自然科学版, 1997, 31(1):104-109. Ying J, Jia Y, Chen Z C, et al. Theoretical and experimental research on thermal contact resistance of rough surfaces [J]. Journal of Zhejiang University: Natural Science, 1997, 31(1):104-109. [10]刘菊. 固体界面接触热阻及导热系数测量的实验研究 [D]. 武汉:华中科技大学, 2011.Liu J. Experimental Research on Measurement of Thermal Contact Resistance and Heat Conductivity Coefficient at Solid Interface [D]. Wuhan: Huazhong University of Science and Technology, 2011. [11]张平, 宣益民, 李强. 界面接触热阻的研究进展[J]. 化工学报, 2012, 63(2):336-337.Zhang P, Xuan Y M, Li Q. Research progress of thermal contact resistance at interface [J]. Journal of Chemical Engineering, 2012, 63(2):336-337. [12]顾慰兰. 接触热阻的试验研究[J]. 南京航空学院学报, 1992, 24(1):46-53. Gu W L. Experimental research on thermal contact resistance [J]. Journal of Nanjing Aeronautical Institute, 1992, 24(1):46-53. [13]Cooper M G, Mikic B B, Yovanovich M M. Thermal contact conductance [J]. Int. J. Heat Transfer,1968, 12:279-300. [14]Blaise A, Bourouga B, Abdulhay B, et al. Thermal contact resistance estimation and metallurgical transformation identification during the hot stamping [J]. Applied Thermal Engineering, 2013,61:141-148. [15]Abdulhay B,Bourouga B, Dessain C, et al. Experimental study of heat transfer in hot stamping process [J]. Int. J. Mater. Form., 2009, 2(1):255-257. [16]Chao W, YiSheng Z, XiaoWei T, et al. Thermal contact conductance estimation and experimental validation in hot stamping process [J]. SCIENCE CHINA Technological Sciences, 2012, 55(7):1852-1857. [17]山东科技大学. 一种用于测定热冲压过程中接触热阻的装置及方法:中国,CN103018137A[P].2013-04-03.Shandong University of Technology. A kind of device and method of measuring thermal contact resistance during hot stamping:China, CN103018137A[P]. 2013-04-03.
|