[1]刘菊. 固体界面接触热阻及导热系数测量的实验研究[D]. 武汉:华中科技大学, 2011.
Liu J. The Experimental Research on Measurement of Thermal Contact Resistance of Two Contacted Solids and Thermal Conductivity [D]. Wuhan: Huazhong University of Science and Technology, 2011.
[2]祁宁. 固-固界面接触热阻的实验研究及数据库查询系统的开发[D]. 南京:南京理工大学, 2014.
Qi N. Experimental Study on Thermal Contact Resistance between Solid-Solid Surfaces and Development on Database Query System [D]. Nanjing: Nanjing University of Science & Technology, 2014.
[3]王安良, 赵剑锋. 接触热阻预测的研究综述[J]. 中国科学: 技术科学, 2011, 41(5): 545-556.
Wang A L, Zhao J F. Review of prediction for thermal contact resistance [J]. Sci. China Tech. Sci., 2011, 41(5): 545-556.
[4]张平, 宣益民, 李强. 界面接触热阻的研究进展[J]. 化工学报, 2012, 63(2): 335-349.
Zhang P, Xuan Y M, Li Q. Development on thermal contact resist-ance [J]. CIESC Journal, 2012, 63(2): 335-349.
[5]刘冬欢, 郑小平, 黄拳章, 等. C/C 复合材料与高温合金 GH600 之间高温接触热阻的试验研究[J]. 航空学报, 2010, 31(11): 2189-2194.
Liu D H, Zheng X P, Huang Q Z, et al. Experimental investigation of high-temperature thermal contact resistance between C/C composite material and superalloy GH600 [J]. Acta Aeronautica et Astronautica Sinica, 2010,31(11): 2189-2194.
[6]Teertstra P. Thermal conductivity and contact resistance measurements for adhesives [A]. ASME/JSME2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference [C]. USA, 2007.
[7]毕冬梅, 陈焕新, 王丽萍, 等. 低温下接触界面热阻的实验与模拟研究[J]. 低温工程, 2011, (5): 46-49.
Bi D M, Chen H X, Wang L P, et al. Simulation study on thermal boundary resistance between different metals at low temperature [J]. Cryogenics, 2011,(5): 46-49.
[8]顾慰兰. 接触热阻的试验研究[J]. 南京航空航天大学学报, 1992, 24(1): 46-53.
Gu W L. Experiment on thermal contact resistance [J]. Journal of Nanjing Aeronautical Institute, 1992, 24(1): 46-53.
[9]杨世铭, 陶文铨. 传热学[M]. 4版. 北京: 高等教育出版社,2006.
Yang S M, Tao W Q. Heat Transfer Theory [M]. Fourth Edition. Beijing:Higher Education Press, 2006.
[10]徐宏伟, 戴艳俊, 孟德芳, 等. 接触热阻对薄板零件表面激光淬火温度场形成影响研究[J]. 应用激光, 2013, 32(6): 516-518.
Xu H W, Dai Y J, Meng D F, et al. Study on the influence of thermal contact resistance on temperature field of laser quenching on surface of sheet[J]. Applied Laser, 2013, 32(6): 516-518.
[11]毕冬梅, 陈焕新, 王钊, 等. 温度及加载压力对低温下固-固接触热阻的影响[J]. 华中科技大学学报: 自然科学版, 2011, 39(5): 128-132.
Bi D M, Chen H X, Wang Z, et al. Influence of temperature and pressure on solid to solid thermal contact resistance [J]. Journal of Huazhong University of Science and Technology: Natural Science Edition, 2011, 39(5): 128-132.
[12]张立强, 刘婷, 郑文慧, 等. 基于Dynaform的22MnB5高强度钢热冲压仿真[J]. 锻压技术, 2015, 40(8): 34-40.
Zhang L Q, Liu T, Zheng W H, et al. Simulation on hot stamping of high strength steel 22MnB5 based on Dynaform [J]. Forging & Stamping Technology, 2015, 40(8): 34-40.
[13]吴圣陶, 曾柯杰, 刘恒. 接触热阻的计算及 ICEPAK 环境下的数值模拟[J]. 通信技术, 2013, 46 (1): 101-104.
Wu S T, Zeng K J, Liu H. Computing model and numerical simulation of thermal contact resistance [J]. Communications Technology, 2013, 46 (1): 101-104.
[14]吴登倍. 接触热阻实验与数值模拟[D]. 北京:北京交通大学, 2011.
Wu D B. Experiment and Numerical Simulation of Thermal Contact Resistance [D]. Beijing:Beijing Jiaotong University, 2011.
|