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时效处理对冷轧铜镍硅合金板带组织及性能的影响
英文标题:Effect of aging treatment on microstructure and properties of cold rolled Cu-Ni-Si alloy strip
作者:刘劲松 武安琪 王松伟 陈帅峰 陈岩 宋鸿武 张士宏 
单位:沈阳理工大学 中国科学院金属研究所 江西铜业技术研究院有限公司 
关键词:铜镍硅合金 时效处理 冷轧 显微组织 力学性能 电导率 
分类号:TG146.1
出版年,卷(期):页码:2022,47(8):215-223
摘要:

 利用真空熔炼炉制备得到Cu-2.36Ni-0.60Si-0.13Mg-0.059Zn合金铸锭,采用热锻开坯、再进行热轧得到厚度为12 mm的合金板材,然后经过多道次冷轧得到厚度为1 mm的合金带材,并对其进行不同条件下的时效处理。采用光学金相(OM)、电子背散射衍射(EBSD)、力学性能测试和电学性能测试等手段对合金带材冷轧及时效过程进行微观组织、力学性能和电导率测试。结果表明:随着轧制变形量的不断增加,初始组织向纤维状转变,晶粒破碎,合金硬度升高,当轧制变形量为90%时,显微硬度可达203.8 HV;冷轧板材经过450 ℃保温6 h时效处理后,可获得较好的综合性能(显微硬度达到281.4 HV,电导率达到46.4%IACS);随着时效温度的升高,第二相的尺寸明显增大,由9.0 nm增大至24.9 nm,且时效处理后基体高斯(Goss)和Z形织构转变为旋转立方(R-cube)和高斯(Goss)织构。

 Cu-2.36Ni-0.60Si-0.13Mg-0.059Zn alloy ingot was prepared by vacuum melting furnace, and the alloy plate with the thickness of 12 mm was obtained by using hot forging to cogging and then hot rolling. Then, the alloy strip with the thickness of 1 mm was obtained by multi-pass cold rolling, and the aging treatments under different conditions were conducted. Furthermore, the microstructure, mechanical properties and electrical conductivity of the alloy strip during cold rolling and aging processes were tested by optical metallography (OM), electron backscatter diffraction (EBSD), mechanical property test and electrical property test. The results show that with the continuous increasing of rolling deformation amount, the initial microstructure changes to fibrous, the grains are broken, and the hardness of alloy is improved. When the rolling deformation amount is 90%, the microhardness reaches 203.8 HV. After aging treatment at 450 ℃ for 6 h, the better comprehensive properties with the microhardness of 281.4 HV and the electrical conductivity of 46.4% IACS for the cold rolled plate are obtained. With the increasing of aging temperature, the size of the second phase increases obviously from 9.0 nm to 24.9 nm, and the matrix Goss and Z-shaped textures are transformed into R-cube and Goss textures after aging treatment.

基金项目:
中国科学院重点部署项目(ZDRW-CN-2021-3)
作者简介:
作者简介:刘劲松(1971-),男,博士,副教授,E-mail:jsliu@imr.ac.cn;通信作者:王松伟(1990-),男,博士,助理研究员,E-mail:swwang16b@imr.ac.cn
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