Transactions of Materials and Heat Treatment

Title：Numerical simulation of CPU heat sink extrusion process and die optimum design

Authors： HE You-feng XIE Shui-sheng CHENG Lei HUANG Guo-jie FU Yao (State Key Laboratory for Fabrication and Process of Nonferrous Metals Beijing General Research Institute of Nonferrous metals Beijing 100088 China)

Unit：

KeyWords： pocket die extrusion numerical simulation die optimum design

ClassificationCode：TG376

year,vol(issue):pagenumber：2009,34(4):126-129

Abstract：

Based on the rigid-viscoplasticity finite element method,the pocket die extrusion process of CPU heat sinks was successfully simulated using Deform-3D software.The distribution of extrusion load,stress field and the velocity in the die exit and metal flow in the extrusion process were obtained.The simulation results show that the metal flow velocity in the bearing exit of the original die is non-uniform;especially the heat sink fins velocities of the outer profile are more slowly.Aiming at solving this problem,the uniform metal flow velocity in the bearing exit were obtained through modifying the pocket die structure,which also decreased the die stress and increased the die life.The simulation results provide the instruction for the pocket die design and optimization.

Funds：

“十一五”国家科技支撑计划(2007BAE38B00)

Reference：

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