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Title:Experimental research of influence factors on solid interface thermal contact conductance coefficient
Authors: ZHU De-cai1 2 ZHANG Li-wen1 2 PEI Ji-bin1 2 ZHANG Guo-liang2 WEI Rong-xuan2(1.The State Key Laboratory for Materials Modification by Laser Ion and Electron Beams Dalian University of Technology Dalian 116024 China 2.School of Materials Science and Enginee 
Unit:  
KeyWords: thermal contact conductance coefficient measuring equipment plastic forming 
ClassificationCode:TK124
year,vol(issue):pagenumber:2008,33(1):139-143
Abstract:
A set of self-developed thermal contact conductance(TCC) measuring equipment was employed.The TCC coefficient between aluminum alloy and 5CrMnMo die steel,and that between stainless steels were measured by this system.The main influencing factors on TCC related to the interfacial temperature and the contact pressure were analysed.The change of the TCC coefficient was also analyzed when the contact processes were different.The results show that the TCC coefficient is not directly proportional to interfacial temperature,but is roughly in proportion to contact pressure,and the TCC coefficient will be much different when the contact processes are changed.
Funds:
国家“973”资助项目(51319)
AuthorIntro:
Reference:
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