Transactions of Materials and Heat Treatment

Title：Research on thermo-physical parameters in continuous hot stamping

Authors： Li Qinyi Chen Qiwei

Unit： Anhui University of Technology

KeyWords： continuous hot stamping numerical simulation orthogonal test thermo-physical parameters

ClassificationCode：TG306

year,vol(issue):pagenumber：2014,39(8):19-23

Abstract：

For hot stamping of U-shaped part, numerical simulation, orthogonal test and function fitting were applied to study the variation of mold temperature in continuous hot stamping, and the influence of thermal conductivity of mold, thermal contact conductance between mold and blank and convective heat transfer coefficient of the coolant on mold temperature were also studied. Results show that in continuous hot stamping of U-shaped part, the mold temperature rises in fluctuation until thermal balance when the amplitude of fluctuation is no longer changing. Lower temperature of mold leads to better quenching effect. Increasing thermal conductivity of mold as well as convective heat transfer coefficient of the coolant leads to lower mold temperature. Increasing thermal contact conductance between mold and blank leads to higher mold temperature and parabolic cooling velocity variation of the U-shaped part, and a reasonable range for the value of thermal contact conductance can be obtained by calculation.

Funds：

安徽省科技攻关项目（12010202015）

李沁怡（1989-），女，硕士研究生

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