Transactions of Materials and Heat Treatment

Title：Residual stress analysis on bonding interface for cold-rolled copper/aluminum composite plate

Authors： Zhang Jiang Zhu Lin Gao Xiangyu Chen Shenglu

Unit： Taiyuan University of Science and Technology

KeyWords： deformation characteristics cold-rolling copper/aluminum composite plate residual stress

ClassificationCode：TG335

year,vol(issue):pagenumber：2016,41(2):30-34

Abstract：

For the deformation characteristics of the cold-rolled copper/aluminum composite plate and distribution of the residual stresses of bonding interface under the different rolling processes, the residual stresses of bonding interface brought by the rolling speed, synchronous rolling of non-equal sized rolls and asymmetrical rolling of non-equal sized rolls were analyzed by FEM. Studies show that the deformation process of copper/aluminum composite plate is made up of four parts. The strain of copper plate on the bonding surface directly affects the compound effect. In the process of synchronous rolling with non-equal sized rolls, the total deformation of copper composite plate increases with the increase of the roller diameter ratio. When the roller diameter ratio is greater than 1.6, the increment of the total deformation is not obvious, and when diameter ratio of the rolls is 1.4-1.6, the residual stress is low. In the process of asymmetrical rolling with non-equal sized rolls, the total deformation of copper composite surface increases with the increase of the roller diameter, and when the circumferential velocity ratio of rolling is 1.2-1.4, the residual stresses is low.

Funds：

国家重点基础研究发展计划项目(2012CB722801)

张将（1989-），男，硕士研究生朱琳（1971-），女，博士，讲师

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