Transactions of Materials and Heat Treatment

Title：Densification behavior of powder pressing for Ag-Cu solder

Authors： Liu Yunzhan Hu Jianhua Huang Shangyu Hu Fei Ding Pengfei Li Xin

Unit： Wuhan University of Technology

KeyWords： Ag-Cu solder powder pressing EDEM discrete element density of compaction numerical simulation

ClassificationCode：TF124

year,vol(issue):pagenumber：2018,43(4):76-82

Abstract：

Based on Hysteretic Spring contact model, the pressing process of BAg72Cu28 and BAg47Cu53 solder was simulated by discrete element software EDEM, and the pressing experiments at low speed of BAg47Cu53 solder were carried out. Then, the influences of forming mechanism, characteristics of velocity field, pressing speed and friction coefficient of solder pressing on the density of compaction were analyzed. The results show that the velocity of top powder is the biggest in the early stage of pressing, while the velocity of middle powder is the biggest in the middle and late stages of pressing. The density distribution characteristics of compaction are in agreement with the velocity field characteristics in the middle and late stages. The density uniformity of compaction in high speed pressing is better than that in low speed pressing when pressing the same density of compaction. But the lower the friction coefficient between particles is, the higher the density uniformity of compaction is. And, the lower the friction coefficient under the same pressing force is, the higher the density of compaction is. In addition to the loose state, the density difference of compaction between simulation and experiment in low speed pressing of BAg47Cu53 solder is less than 6%, and the Hysteretic Spring contact model has higher simulation accuracy for solder pressing simulation.

Funds：

国家自然科学基金资助项目（51475345）；华中科技大学材料成形与模具技术国家重点实验室开放基金（P2015-01）

刘运展（1993-），男，硕士研究生；E-mail：453178919@qq.com；通讯作者：胡建华（1966-），男，博士，副教授；E-mail： hujianhua@whut.edu.cn

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