Transactions of Materials and Heat Treatment

Title：Interface and mechanical properties analysis of transient liquid phase diffusion bonding for GH4169

Authors： Yang Linlin Lang Lihui Li Xiaoxing Mei Han Wang Wenpeng Xu Wencai

Unit： Beihang University

KeyWords： high-temperature alloy GH4169 TLP-DB joint strength interface analysis mechanical property

ClassificationCode：TG389

year,vol(issue):pagenumber：2019,44(3):149-154

Abstract：

The aviatic high-temperature alloy GH4169 was bonded by transient liquid phase diffusion bonding (TLP-DB), and an effective connection of GH4169 under a series of main process parameters such as pressure, temperature and holding time was achieved by BNi2 solder used as the inter layer material. Then, comparing with the direct diffusion connections under the same conditions, the characteristics of microstructure, element distribution and joint strength of the TLP-DB joint interface were analyzed by metallographic microscope, scanning electron microscope, energy spectrum analyzer and tensile testing machine. The results show that the tensile strength at room temperature (1006 MPa) of the TLP-DB joint is close to that of the base metal under the conditions of pressure 20 MPa, temperature 1100 ℃ and holding time 90 min, which is much higher than that of the direct diffusion bonding under the same process conditions. The tensile fracture mode of the joint is brittle fracture with a few dimples. Furthermore, after plastic deformation and element diffusion, the number of pores in the diffusion layer at the interface of the joint decreases and new intermetallic compounds are produced. The changes of pores and compounds affect the mechanical properties of the joint.

Funds：

国家自然科学基金资助项目（51675029）

杨琳琳（1992-），女，硕士研究生，E-mail：yanglinlin@buaa.edu.cn；通讯作者：郎利辉（1970-），男，博士，教授，E-mail：lang@buaa.edu.cn

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