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Abstract：
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In order to solve the deformation problem of IGBT (Insulated Gate Bipolar Transistor) copper base plate due to welding thermal stress and improve the design success rate of pre-bending stamping die as well as reduce the development costs, a design method of pre-bending stamping die based on simulation and semi-inverse solution theory was promoted. Then, the specific practices were as follows. Firstly, the curved surface characteristic of stamping die was digitized, and the arc loss base was calculated according to the experimental results. Next, the relevant physical properties of materials were corrected, and the single-arc characteristic curve was fitted by simulating the welding process. Finally, the double-arc characteristic curves were obtained by combining arc loss base and introducing proportional coefficient, and the corresponding curved surface of die was designed depending on the above curves. In addition, the validity of proportion coefficient was verified, and the effect of this method was studied by simulation. The result shows that the height difference of copper base plate in the length direction caused by welding is reduced from 400 μm to 74.4 μm。
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Funds：
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省级科技专项资金（BA2016091）
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AuthorIntro：
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李磊（1989-），男，硕士，E-mail：l_li@macmicst.com
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Reference：
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