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Title:Defect analysis and process optimization on aluminum alloy dustproof enclosure
Authors: Lin Chengfeng  Wu Danping  Ye Nengyong  Wu Ting  Huang Zican  Wang Lei 
Unit: Taizhou Baida Electric Co.  Ltd. Taizhou University 
KeyWords: dustproof enclosure  mold structure  high level stress  metal flow 
ClassificationCode:TG316.3
year,vol(issue):pagenumber:2020,45(8):32-37
Abstract:
In order to realize the lightweight of auto parts and improve the life of mold, for the situation where the bottom ‘dropping’ and the high level stress of mold during the deformation process of cold forging for aluminum alloy dustproof enclosure of automotive electronic vacuum pump, its forming process was simulated and analyzed by finite element method Deform-3D. Then, the causes of defects were studied, and the forming process and the mold structure were optimized. The results show that the reason for the phenomenon of ‘dropping’ of aluminum alloy dustproof enclosure is that the blank at the edge of bottom is finally filled due to bending deformation during the forming process, and the metal flow is relatively sheared during the filling process to lead to the falling off of metal at the edge. Therefore, the phenomenon of ‘dropping’ for the dustproof enclosure is effectively solved by optimizing the blank structure, and the high level stress of punch is effectively relieved by reducing the straight wall height of die to improve the life of mold.
Funds:
浙江省自然科学基金资助项目(LQ19E050004)
AuthorIntro:
林程峰(1986-),男,大专,助理工程师,E-mail:406389946@qq.com;通讯作者:叶能永(1986-),男,工学博士,讲师,E-mail:yny1030@163.com
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