Transactions of Materials and Heat Treatment

Title：Influence of backpressure and temperature on copper deformation in BP-ECAP

Authors： Wu Chunling Zhou Long Chen Bin Liu Xia

Unit： Hubei University of Technology China Communications Second Aviation Engineering Bureau Co. Ltd. Key Laboratory of Construction Technology of Bridge Construction and Transportation Industry Transportation Industry Intelligent Manufacturing Technology R & D Center

KeyWords： backpressure-equal-channel angular pressing backpressure compactness ultra-fine grain structure equivalent strain

ClassificationCode：TG379

year,vol(issue):pagenumber：2020,45(9):187-193

Abstract：

Backpressure-equal-channel angular pressing (BP-ECAP) can greatly improve the grain refinement and prevent the generation of cracks at the same time, so that the microstructure and mechanical properties of sample are significantly improved. Then, the backpressure-equal-channel angular pressing process of pre-compressed copper chips was simulated by finite element software Deform-3D, and the changes of equivalent strain under different backpressures and temperatures were analyzed to explore the optimal temperature and backpressure, so that the copper chips with ultra-fine crystal structure improved the compactness and maintained its ultra-fine crystal microstructure to the maximum extent during the block forming process. The results show that when the backpressure is within 0-50 MPa or the temperature is between 20-300 ℃, increasing the backpressure or temperature increases the equivalent strain on the copper, the deformation is more uniform, and the compactness of sample is high. However, when the backpressure exceeds 50 MPa or the temperature is higher than 300 ℃, the equivalent strain on the copper is greatly reduced. Finally, when the backpressure is 50 MPa and the temperature is 300 ℃, the copper is subjected to the largest strain, the uniform deformation, the better grain refinement and the high compactness.

Funds：

国家自然科学基金资助项目（51505135）；湖北工业大学博士启动金项目（BSQD13023,BSQD2015017）

吴春凌（1976-），女，博士，副教授 E-mail：chunling_wu@126.com 通讯作者：周龙（1995-），男，硕士研究生 E-mail：1515250067@qq.com

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