锻压技术

热流道板瞬态温度场数值模拟及其电热丝布局优化设计

英文标题：Numerical simulation of transient temperature field and optimization design of hot runner board of injection mold

作者：李姣李熹平管延锦赵国群李磊王小新

分类号：TQ320.66

出版年,卷(期):页码：2010,35(4):102-106

摘要：

热流道板是注塑模具热流道系统的主要组成元件，其温度分布的均匀性对整个热流道系统及其注塑产品的质量都有重要影响。以液晶电视机后壳为例，设计了热流道板的基本结构，研究了其加热过程的温度场分布。根据有限元初次模拟结果出现的温度分布均匀性差的问题，优化了热流道板内电热丝的布局，获得了温度分布均匀的热流道板结构。将获得的热流道板结构应用于热流道系统的设计与工程实践中，获得了质量优越的产品。

Hot runner board is the main component of hot runner system in plastic injection mould. The uniformity of its temperature distribution has an important effect on the entire hot runner system and the injection molding product's quality. Taking the LED TV back cover as an example, the basic structure of the hot runner board was designed and its temperature field distribution during the heating process was also studied. Based on the problems of bad uniformity of temperature distribution appeared in the primary finite element analysis results, an optimization design for the layout of the electric heating wire inside the hot runner board was carried on, and the hot runner board structure which had uniform temperature distribution was obtained. Applying the hot runner board structure obtained to the hot runner system's design and the project practice，superior quality products were got.

基金项目：

新世纪优秀人才支持计划（NCET-08-0337）；山东大学自主创新基金杰出青年培育项目资助（2009JQ012）

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