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摘要：
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扩散连接工艺具有用于微零件连接的能力，广泛应用于连接微通道结构。为了预测连接结构变形，考虑了表面源扩散机制、界面源扩散机制和热蠕变机制下连接变形规律，建立了扩散连接工艺参数与微通道结构变形动力学模型。为检验该模型应用，采用了TC4合金的参数迭代计算，最后得到连接温度、有效压力和连接时间与结构变形的关系。分析结果显示：提高连接温度和有效压力都使微通道结构变形程度加大；经3组模拟实验比较，变形程度对连接压力参数较为敏感；界面源扩散为初期主要机制，全程由蠕变-表面源机制主导，其中蠕变机制是扩散连接的主要机制。
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Diffusion bonding process has a potential on bonding micro-parts and is applied to connection of micro-channel structures. To predict the deformation of this bonding structure, considering bonding deformation rules under surface-source and interface source diffusion mechanisms and hot creep mechanism, a dynamic model with the relationship of diffusion bonding process parameters and micro-channel structural deformation was built. To verify the application of the model, parameters of TC4 alloy were used to calculate iteratively. Finally, the relationship of structural deformation and diffusion bonding parameters including bonding temperature, effective pressure and bonding time were obtained. Analysis result shows that increasing bonding temperature and effective pressure make deformation of micro-tunnel structure increase. In three different simulation experiments, the deformation is more sensitive to bonding pressure parameters. In addition, interface source diffusion is the main mechanism in the initial stage, and surface source diffusion and creep mechanism is dominant in the whole stage. Among them, creep mechanism is the main mechanism in diffusion bonding.
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基金项目：
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国家自然科学基金资助项目（51675029）
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作者简介：
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郎利辉（1970-），男，博士，教授
E-mail：lang@buaa.edu.cn
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