锻压技术

GH4169瞬时液相扩散连接界面及力学性能分析

英文标题：Interface and mechanical properties analysis of transient liquid phase diffusion bonding for GH4169

作者：杨琳琳郎利辉李晓星梅寒王文鹏徐文才

单位：北京航空航天大学

分类号：TG389

出版年,卷(期):页码：2019,44(3):149-154

摘要：

采用真空瞬时液相扩散连接技术（TLP-DB）对航空用高温合金GH4169进行了连接；在一定压强、温度及保温时间等主要工艺参数下，使用BNi2钎料作为中间层材料，实现GH4169的有效连接。用金相显微镜、扫描电镜、能谱分析仪和拉伸试验机等设备，对比相同条件下的直接扩散连接，分析TLP-DB的接头界面组织形貌、元素分布及连接强度等特点。结果表明：GH4169合金在压强20 MPa、温度1100 ℃、保温保压时长90 min的条件下，TLP-DB连接接头的室温抗拉强度（1006 MPa）接近母材室温抗拉强度，远高于同工艺条件下直接扩散连接强度；连接接头的拉伸断裂方式为脆性断裂，有少量韧窝的存在；经过塑性变形和元素扩散，接头界面的扩散层孔隙数目减少并产生了新的金属间化合物，孔隙和化合物的变化影响着接头的力学性能。

The aviatic high-temperature alloy GH4169 was bonded by transient liquid phase diffusion bonding (TLP-DB), and an effective connection of GH4169 under a series of main process parameters such as pressure, temperature and holding time was achieved by BNi2 solder used as the inter layer material. Then, comparing with the direct diffusion connections under the same conditions, the characteristics of microstructure, element distribution and joint strength of the TLP-DB joint interface were analyzed by metallographic microscope, scanning electron microscope, energy spectrum analyzer and tensile testing machine. The results show that the tensile strength at room temperature (1006 MPa) of the TLP-DB joint is close to that of the base metal under the conditions of pressure 20 MPa, temperature 1100 ℃ and holding time 90 min, which is much higher than that of the direct diffusion bonding under the same process conditions. The tensile fracture mode of the joint is brittle fracture with a few dimples. Furthermore, after plastic deformation and element diffusion, the number of pores in the diffusion layer at the interface of the joint decreases and new intermetallic compounds are produced. The changes of pores and compounds affect the mechanical properties of the joint.

基金项目：

国家自然科学基金资助项目（51675029）

杨琳琳（1992-），女，硕士研究生，E-mail：yanglinlin@buaa.edu.cn；通讯作者：郎利辉（1970-），男，博士，教授，E-mail：lang@buaa.edu.cn

参考文献：

［1］Zhou J, Han R D. Experimental study of green high-speed turning nickel-based superalloy GH4169
［J］. Applied Mechanics and Materials, 2010, 26-28:1132-1136.

［2］Uehara T, Wakabayashi N, Hirabayashi Y, et al. An atomistic study of grain boundary stability and crystal rearrangement using molecular dynamics techniques
［J］.International Journal of Mechanical Sciences, 2008, 50(5): 956-965.

［3］Davoodi Jamaloei A, Khorram A, Jafari A . Characterization of microstructure and mechanical properties of dissimilar TLP bonding between IN718/IN600 with BNi-2 interlayer
［J］. Journal of Manufacturing Processes, 2017, 29:447-457.

［4］Ram G D J, Reddy A V, Rao K P, et al. Microstructure and tensile properties of Inconel 718 pulsed Nd-YAG laser welds
［J］. Journal of Materials Processing Technology, 2005, 167(1): 73-82.

［5］Bing W U, Jinwei L I, Gong S. Crack tolerance of heat rolling nickel-based super-alloy joints in electron beam welding
［J］. Transactions of the China Welding Institution, 2010, 31(4): 38-40.

［6］Yang J, Lou S N, Yan J M, et al. Grain distribution properties of super-alloy GH4169 inertia friction welded joint
［J］. Transactions of the China Welding Institution, 2001,22(3):33-35.

［7］于康. GH4169合金真空扩散连接技术研究
［D］. 哈尔滨：哈尔滨工业大学，2010.

Yu K. Research on Technic of Vacuum Diffusion Bonding of GH4169 Alloy .
［D］. Harbin：Harbin Institute of Technology, 2010.

［8］Han W B,Zhang K F, Wang G F, et al. Research on microstructures and properties of diffusion bonding joints for Inconel 718 superalloy
［J］. Material Science and Technology, 2005, 13(3): 308-311.

［9］Arafin M A, Medraj M, Turner D P, et al. Transient liquid phase bonding of Inconel 718 and Inconel 625 with BNi-2: Modeling and experimental investigations
［J］. Materials Science and Engineering A, 2007, 447(1-2):125-133.

［10］Liu J D, Jin T, Zhao N R, et al. Effect of transient liquid phase (TLP) bonding on the ductility of a Ni-base single crystal superalloy in a stress rupture test
［J］. Materials Characterization, 2008, 59(1):68-73.

［11］Shamsabadi A Y, Bakhtiari R, Eisaabadi B G. TLP bonding of IN738/MBF20/IN718 system
［J］. Journal of Alloys and Compounds, 2016, 685:896-904.

［12］Pouranvari M. Solid solution strengthening of transient liquid phase bonded nickel based superalloy
［J］. Materials Science and Technology, 2015, 31(14): 1773-1780.

［13］Li Q, Guyot B M, Richards N L. Effect of processing parameters on grain boundary modifications to alloy Inconel 718
［J］.Materials Science and Engineering, 2007, 458(1): 58-66.

［14］Pouranvari M, Mousavizadeh S M. Use of larson-miller parameter for modeling the progress of isothermal solidification during transient-liquid-phase bonding of IN718 superalloy
［J］. Material in Tehnologije, 2015, 49(2): 247-251.

［15］王义峰. GH4169合金瞬时液相连接及后热处理工艺与机理研究
［D］. 哈尔滨：哈尔滨工业大学，2012.

Wang Y F. Research on Process and Mechanism of Transient Liquid Phase Bonging of GH4169 Alloy and Post-weld Heat Teat Treatment
［D］. Harbin：Harbin Institute of Technology, 2012.

［16］宋晓国，曹健，冯吉才，等. 连接温度对GH4169合金TLP接头界面组织和性能的影响
［J］. 中国有色金属学报，2012，22(9)：2516-2521.

Song X G, Cao J, Feng J C, et al. Effect of bonding temperature on interfacial microstructure and properties of GH4169 alloy TLP joints
［J］. Chinese Journal of Nonferrous Metals, 2012, 22(9): 2516-2521.

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