To investigate the microstructure evolution laws and properties of special-shaped copper strip materials, C192 irregular section copper strip was prepared by the self-developed high-frequency forging and rolling automated production line, and the microstructure evolution during the die forging process for forging and rolling was analyzed by metallographic (OM), electron backscatter diffraction (EBSD) and universal tensile testing methods. The test results show that during the die forging process, the grain size is refined and the preferred grain orientation is <101 >, and the grains in the thin material area show obvious deformation direction. Through the mechanical properties test, it is found that the tensile strength, yield strength and Vickers hardness of thin material are better than those of thick material, while the plasticity of thick material is slightly better than that of thin material. The conductivity was tested, and it is found that the thin material is subjected to solution annealing treatment after die forging, and its grain size gradually recoveres to the initial state of die forging, reducing the difference in conductivity between thick and thin materials. Thus, the die forging process has a significant impact on the microstructure and performance of irregular section copper strip, and optimizing the process parameters can improve the comprehensive performance of irregular section copper strip.