Transactions of Materials and Heat Treatment

Title：Overview of methods for measuring and calculating thermal contact resistance at the interface of die and blank during hot forming quenching process

Authors： Xu Hong Yang Xiuchen Gu Zhengwei Li Xin Zhang Zhiqiang Lan Bo

Unit： Jilin University

KeyWords： hot forming interface thermal contact resistance inverse heat conduction contact resistance

ClassificationCode：TG306；O0551.1

year,vol(issue):pagenumber：2015,40(5):124-128

Abstract：

Mechanism of thermal contact resistance (TCR) at the interface of solid-solid and factors which have influence on TCR value were researched. According to the heat transfer model of the interface between die and blank in the hot forming quenching and the analysis on heat transfer at the interface based on Fouriers law, representing method of interface TCR was deduced by the ideas of thermal resistance. The existing methods of measuring and calculating TCR at the interface of die and blank in the hot forming quenching process were reviewed. Based on differential equation of heat conduction and Fouriers law, TCR can be calculated through measuring heat flow density by inverse heat conduction method, while based on contact resistance and TCR generated for the same reason, TCR can be calculated by indirect method according to the relationship of contact resistance measured by specific device and TCR. At last, inverse heat conduction method and indirect method were compared according to the measuring apparatus, the calculating principles and process. At the same time, the importance of interface TCR to the design of hot forming die and the development of new material were analyzed.

Funds：

国家自然科学基金资助项目（51205162）；国家科技重大专项（2009ZX04014-72-01）；吉林省科技发展计划项目（20110301）

徐虹（1972-），女，博士，副教授杨秀臣（1990-），男，硕士研究生

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