Transactions of Materials and Heat Treatment

Title：Experimental investigation on contact thermal resistance between boron steel and die and its application to springback simulation

Authors： Liu Zhimiao Lin Jianping Wang Xuesong Shu Changle

Unit： Tongji University

KeyWords： contact thermal resistance boron steel hot stamping springback simulation steady-state method

ClassificationCode：TG306

year,vol(issue):pagenumber：2017,42(4):165-169

Abstract：

The contact thermal resistance is an important influence of thermal propagation in the hot stamping process. However, the temperature difference among various regions of parts affects the hot stamping springback directly. So it is of great significance to obtain accurate contact thermal resistance for improving springback simulation accuracy in the hot stamping process. The measurement experiment on contact thermal resistance between boron sheet 22MnB5 and die steel Cr7V was designed by the steady-state method, and the calculation formula of contact thermal resistance was deduced. According to this measurement method, a test platform was built, and values of contact thermal resistance under different pressures were obtained respectively. Finally, a relational equation between contact thermal resistance and pressure was fitted. Furthermore, the relational equation was input into a B-pillar hot stamping springback simulation, and the improved simulation results were closer to the experimental one by comparing with the original simulation results. Thus, it is indicated that obtaining accurate relational equation between contact thermal resistance and pressure can improve simulation accuracy of springback in the hot stamping for boron steel.

Funds：

国家自然科学基金资助项目（51375346）

刘志淼（1992-），女，硕士研究生 E-mail：liuzm0524@163.com 通讯作者：林建平（1958-），男，博士，教授 E-mail：jplin58@tongji.edu.cn

Reference：

[1]刘菊. 固体界面接触热阻及导热系数测量的实验研究[D]. 武汉：华中科技大学, 2011.

Liu J. The Experimental Research on Measurement of Thermal Contact Resistance of Two Contacted Solids and Thermal Conductivity [D]. Wuhan: Huazhong University of Science and Technology, 2011.

[2]祁宁. 固-固界面接触热阻的实验研究及数据库查询系统的开发[D]. 南京：南京理工大学, 2014.

Qi N. Experimental Study on Thermal Contact Resistance between Solid-Solid Surfaces and Development on Database Query System [D]. Nanjing: Nanjing University of Science & Technology, 2014.

[3]王安良, 赵剑锋. 接触热阻预测的研究综述[J]. 中国科学: 技术科学, 2011, 41(5): 545-556.

Wang A L, Zhao J F. Review of prediction for thermal contact resistance [J]. Sci. China Tech. Sci., 2011, 41(5): 545-556.

[4]张平, 宣益民, 李强. 界面接触热阻的研究进展[J]. 化工学报, 2012, 63(2): 335-349.

Zhang P, Xuan Y M, Li Q. Development on thermal contact resist-ance [J]. CIESC Journal, 2012, 63(2): 335-349.

[5]刘冬欢, 郑小平, 黄拳章, 等. C/C 复合材料与高温合金 GH600 之间高温接触热阻的试验研究[J]. 航空学报, 2010, 31(11): 2189-2194.

Liu D H, Zheng X P, Huang Q Z, et al. Experimental investigation of high-temperature thermal contact resistance between C/C composite material and superalloy GH600 [J]. Acta Aeronautica et Astronautica Sinica, 2010,31(11): 2189-2194.

[6]Teertstra P. Thermal conductivity and contact resistance measurements for adhesives [A]. ASME/JSME2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference [C]. USA, 2007.

[7]毕冬梅, 陈焕新, 王丽萍, 等. 低温下接触界面热阻的实验与模拟研究[J]. 低温工程, 2011, (5): 46-49.

Bi D M, Chen H X, Wang L P, et al. Simulation study on thermal boundary resistance between different metals at low temperature [J]. Cryogenics, 2011,(5): 46-49.

[8]顾慰兰. 接触热阻的试验研究[J]. 南京航空航天大学学报, 1992, 24（1）: 46-53.

Gu W L. Experiment on thermal contact resistance [J]. Journal of Nanjing Aeronautical Institute, 1992, 24（1）: 46-53.

[9]杨世铭, 陶文铨. 传热学[M]. 4版. 北京: 高等教育出版社，2006.

Yang S M, Tao W Q. Heat Transfer Theory [M]. Fourth Edition. Beijing：Higher Education Press, 2006.

[10]徐宏伟, 戴艳俊, 孟德芳, 等. 接触热阻对薄板零件表面激光淬火温度场形成影响研究[J]. 应用激光, 2013, 32(6): 516-518.

Xu H W, Dai Y J, Meng D F, et al. Study on the influence of thermal contact resistance on temperature field of laser quenching on surface of sheet[J]. Applied Laser, 2013, 32(6): 516-518.

[11]毕冬梅, 陈焕新, 王钊, 等. 温度及加载压力对低温下固-固接触热阻的影响[J]. 华中科技大学学报: 自然科学版, 2011, 39(5): 128-132.

Bi D M, Chen H X, Wang Z, et al. Influence of temperature and pressure on solid to solid thermal contact resistance [J]. Journal of Huazhong University of Science and Technology: Natural Science Edition, 2011, 39(5): 128-132.

[12]张立强, 刘婷, 郑文慧, 等. 基于Dynaform的22MnB5高强度钢热冲压仿真[J]. 锻压技术, 2015, 40(8): 34-40.

Zhang L Q, Liu T, Zheng W H, et al. Simulation on hot stamping of high strength steel 22MnB5 based on Dynaform [J]. Forging & Stamping Technology, 2015, 40(8): 34-40.

[13]吴圣陶, 曾柯杰, 刘恒. 接触热阻的计算及 ICEPAK 环境下的数值模拟[J]. 通信技术, 2013, 46 (1): 101-104.

Wu S T, Zeng K J, Liu H. Computing model and numerical simulation of thermal contact resistance [J]. Communications Technology, 2013, 46 (1): 101-104.

[14]吴登倍. 接触热阻实验与数值模拟[D]. 北京：北京交通大学, 2011.

Wu D B. Experiment and Numerical Simulation of Thermal Contact Resistance [D]. Beijing：Beijing Jiaotong University, 2011.

Service：

【This site has not yet opened Download Service】【Add Favorite】