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Abstract：
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Diffusion bonding process has a potential on bonding micro-parts and is applied to connection of micro-channel structures. To predict the deformation of this bonding structure, considering bonding deformation rules under surface-source and interface source diffusion mechanisms and hot creep mechanism, a dynamic model with the relationship of diffusion bonding process parameters and micro-channel structural deformation was built. To verify the application of the model, parameters of TC4 alloy were used to calculate iteratively. Finally, the relationship of structural deformation and diffusion bonding parameters including bonding temperature, effective pressure and bonding time were obtained. Analysis result shows that increasing bonding temperature and effective pressure make deformation of micro-tunnel structure increase. In three different simulation experiments, the deformation is more sensitive to bonding pressure parameters. In addition, interface source diffusion is the main mechanism in the initial stage, and surface source diffusion and creep mechanism is dominant in the whole stage. Among them, creep mechanism is the main mechanism in diffusion bonding.
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Funds：
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国家自然科学基金资助项目（51675029）
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AuthorIntro：
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郎利辉（1970-），男，博士，教授
E-mail：lang@buaa.edu.cn
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Reference：
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