Transactions of Materials and Heat Treatment

Title：Bonding strength analysis on copper/aluminum composite plates with different thickness ratios

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ClassificationCode：TG335.5

year,vol(issue):pagenumber：2019,44(8):162-167

Abstract：

The influences of different thickness ratios of copper to aluminium on the bonding strength of copper/aluminium composite plates were studied by means of experimental research and numerical simulation. The experimental results show that the bonding strength of composite plate increases with the increasing of the thickness ratio of copper to aluminium, and the amount of aluminium adhering to the copper-based peeling surface also increases gradually. When the thickness ratio of copper to aluminium is 1/6 and 1/5, a small amount of fine aluminium ridges and local spot-sheet aluminium chips adhere to the surface of copper base. However, when the copper/aluminum thickness ratio reaches 1/3, the amount of aluminum ridges on the copper-based peeling surface is significantly increased, and the volume of the aluminum ridges becomes larger. Combined with the simulation results, it is found that with the increasing of the thickness ratio of copper to aluminum, the normal stress and equivalent strain at the interface of composite plate gradually increase, which promote the bonding between metals. Therefore, when the thickness ratio of copper to aluminum is relatively small, the strong frictional shear stress at the interface causes the hardened layer on the surface of aluminum based to fall off, and the formed aluminum chips adhere to the copper side.

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山东省教育厅职业教育名师工作室支持项目（201763）

作者简介：张玉静（1982-），女，硕士，讲师 E-mail：710805266@qq.com

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