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Title:Influence of temperature condition on microstructure of Cu tube/Al tube brazed joint produced by magnetic pulse and semi-solid composite auxiliary technology
Authors: Gao Yuan Huang Shangyu Deng Lingbo Feng Ke Huang Haichuan Wang Zhendong 
Unit: School of Materials Science and Engineering  Wuhan University of Technology 
KeyWords: Cu/Al connection  semi-solid technology  temperature conditions  microstructure brazing Cu tube Al tube 
ClassificationCode:TG454
year,vol(issue):pagenumber:2019,44(10):169-175
Abstract:

Based on magnetic pulse and semi-solid composite auxiliary brazing process, Cu/Al tube brazing without flux was realized, and the influences of temperature conditions on the quality of connection were researched. The test results show that when the Zn-15Al brazing temperature is 390 ℃, the solder solid rate is higher, and removing the alumina membrane is failed. Therefore, the spread of solder to base metal at this temperatures is insufficient, the effective metallurgical connection with the copper base metal is not realized, and no CuZn5 phase is found in brazing seam. When the brazing temperature is 410 ℃, the metallurgical connection is good, α phase in brazing seam is near spherical, and CuZn5 and ternary phase are existed. When the Zn-22Al brazing temperature is 430 ℃, removing the alumina membrane is also failed, but the spread of solder is improved, and the metallurgical connection with copper base metal is realized. When the brazing temperature is 460 ℃, the metallurgical bonding is good, but the shape of α phase is irregular. When the brazing temperature is 490 ℃, more θ phases appears in brazing seam. Thus, the solid phase ratio and the spread of solder are influenced by temperature condition, which determines the formation of metallurgical connection, and the content of Cu and the phase growth are different at different temperatures, which determines the microstructure of brazing seam.

 
Funds:
国家自然科学基金资助项目(51605357)
AuthorIntro:
作者简介:高远(1994-),男,硕士研究生 E-mail:1060522929@qq.com 通讯作者: 黄尚宇(1963-),男,硕士,教授 E-mail:huangshy@whut.edu.cn
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