Transactions of Materials and Heat Treatment

Title：Microstructure evolution and interface bonding mechanism on 40Cr/Q345B bimetal in hot compression

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ClassificationCode：TG331

year,vol(issue):pagenumber：2021,46(3):208-215

Abstract：

The hot compression bonding experiments of 40Cr/Q345B bimetal was conducted under the conditions of deformation temperatures of 1000, 1050, 1100 and 1150 ℃, holding time of 30 and 60 min before deformation, and reduction of 50%, 65% and 80%, and its interface bonding behavior was studied. Then, the interfacial microstructure evolution and element diffusion law were studied by optical microscopy (OM) and energy disperse spectroscopy (EDS), and the hardness distribution on the interface was analyzed by micro-hardness tester to reveal the interfacial bonding mechanism of bimetal. The results show that the interfacial bonding of 40Cr/Q345B bimetal is improved with the increasing of deformation temperature at 1000-1150 ℃, and the reduction increases from 50% to 65% which contributes to the interface bonding. When the reduction is 80%, the excessive deformation affects the coordination performance of the matrix on both sides of interface to reduce the bonding strength of interface. In addition, the holding time of 30 min before deformation is also beneficial to interface bonding. As the holding time increases, the grain size of the matrix becomes larger and the hardness decreases to the minimum value of 150 HV on the interface. However, with the increasing of deformation temperature, the hardness at the interface increases, and the maximum value is 185 HV. In the hot compression process of 40Cr/Q345B bimetal, Cr is the main diffusion element, and the diffusion distance is approximately 3.7 μm under the holding time of 30 min before deformation, the reduction of 50% and the deformation temperature of 1150 ℃. Thus, the bonding mechanism is mainly metallurgical bonding.

Funds：

国家自然科学基金资助项目（51875383）

杨超（1995-），男，硕士研究生 E-mail：1655982984@qq.com 通讯作者：秦芳诚（1988-），男，博士，讲师 E-mail：qinfangcheng@glut.edu.cn

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