Transactions of Materials and Heat Treatment

Title：Optimization on parameters of bonding forming process for TC17 titanium alloy hollow component

Authors： Li Miaoquan Sun Jinzhao Li Hong

Unit：

KeyWords：

ClassificationCode：TG453+.1

year,vol(issue):pagenumber：2021,46(9):237-244

Abstract：

To ensure the connection quality and structural integrity of hollow components, the key is to determine reasonable parameters of bonding forming process. Based on the central composite experimental design method and finite element simulation technology, the numerical simulation of the bonding forming process for TC17 titanium alloy hollow component was conducted, and the optimization on process parameters was carried out based on the response surface model. The results show that the plastic strain at the first characteristic point FPI increases greatly and the strain at the second characteristic point FPII decreases greatly with the increasing of temperature, and the rate of increase in the plastic strain at the first characteristic point FPI increases and the rate of increase in the plastic strain at the second characteristic point FPII decreases with the increasing of deformation degree in the bonding forming process of hollow component. By using the temperature and deformation degree as the corresponding variables, a response surface model of the average plastic strain εFPI and response parameter fFPII at the ending time of the quick increase for the bonding rate of interface during the bonding forming process of hollow component was established. After optimization of process parameters, the optimal temperature is about 1073 K and the deformation degree is in the range of 0.510-0.631 mm. The goddnes of fit R2 of response surface model is more than 99% showing that the optimization results of process parameters are reliable.

Funds：

国家自然科学基金资助项目（51275416）

李淼泉（1964-），男，博士，教授 E-mail：honeymli@nwpu.edu.cn

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