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Title:Simulation analysis and springback prediction on U-shaped stamping of medium-thickness plate based on finite element simulation
Authors: Sun Zhankun  Li Tao 
Unit: Inner Mongolia University of Technology  Inner Mongolia University of Science & Technology 
KeyWords: medium-thickness plate  springback compensation U-shaped stamping process negative springback elastic strain 
ClassificationCode:TG386
year,vol(issue):pagenumber:2022,47(5):81-88
Abstract:

 The springback defect during U-shaped stamping process for medium-thickness plate used as large beam steel of heavy truck was studied by finite element simulation. First, the established finite element model was verified by the U-shaped stamping standard test examples given by Numisheet2011. On this basis, a simulation study on the formability of medium-thickness plate for automobile was carried out, and the measures to control the springback were analyzed. The results show that the springback behavior of medium-thickness plate is significant different from that of thin plate, and an obvious local thickness increase emerges around the upper area of upper corner after stamping. Moreover, the elastic strain distribution characteristics on the longitudinal section of sidewall and other parts make the plate material appear negative springback, and the curve of sidewall corresponds to a larger arc radius. At the same time, two stress concentration points appear on the inner sidewall of the U-shaped part, and due to the thicker plate material, the Mises equivalent stress distributions on the inner and outer of the formed part also show significant differences. To avoid the negative springback defect in the stamping of medium-thickness plate, two methods of die springback angle compensation and increasing the clearance between punch and die are used to reduce the springback amount of medium-thickness plate, so as to obtain a better final plate shape.

Funds:
内蒙古自然科学基金资助项目(2014MS0525)
AuthorIntro:
作者简介:孙占坤(1990-),男,博士,讲师,E-mail:sunzk_cailiao@163.com;通信作者:李 涛(1975-),女,博士,教授,E-mail:836450192@qq.com
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