Transactions of Materials and Heat Treatment

Title：Design of compound forming device for metal spring bidirectional shrapnel of plate and wire materials

Authors： Feng Zan1 Wang Chao1 Wang Cheng1 2 3 Rui Yannian2

Unit： 1.School of Mechanical & Electric Technology Suzhou Institute of Trade & Commerce 2.School of Mechanical and Electrical Engineering Suzhou University 3.Jiangsu PV Wind Power Control Engineering Research and Development Center

KeyWords： metal spring bidirectional shrapnel plate and wire materials automatic feeding mechanism punch mechanism forming mechanism

ClassificationCode：TG386

year,vol(issue):pagenumber：2022,47(6):224-230

Abstract：

In order to solve the problems of cumbersome processing procedures, low processing efficiency and the need for multi positioning when metal shrapnel products are processed and formed, through the analysis and research on product materials, structural requirements, forming processes, etc., the forming process of the intermittent automatic feeding of plate and wire materials, continuous punching and numerical control bending was adopted. A metal spring bidirectional shrapnel forming device was proposed, which included a punching mechanism and a forming mechanism. The punching mechanism was used for punching a plurality of sequentially connected pre-products on the plate and wire materials, and the forming mechanism was used for forming elastic pieces.Through the production test, the forming device can be known that the forming device can not only ensure the accuracy of product and save materials, but also shorten the research and development cycle and reduce the cost. It proves the advancement, feasibility and practicability of forming device structure of plate and wire materials, and lays a practical foundation for the application and promotion of the technology.

Funds：

国家高技术研究发展计划（2012AA063506）；苏州市重点产业技术创新项目（SGC2021111）；苏州市应用基础研究计划项目（SNG2020050）；苏州经贸职业技术学院企业横向课题（JMH202004）;苏州市教育科研规划项目(2021JG004);江苏省高等学校大学生创新创业训练计划项目(202112685005Y)

冯赞（2000-），男，专科 E-mail： 2784727769@qq.com 通信作者：王超（1989-），男，博士，讲师 E-mail：wc181674@163.com

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