Transactions of Materials and Heat Treatment

Title：Influences of thickness ratio and annealing temperature on stamping properties and interfacial bonding strength for copper/aluminum cold rolled plate

Authors： Chen Cai1 Kong Cheng1 Wang Mingchuan1 Zhao Jinku2 Du Zhonghua3 Yang Sen4

Unit： 1.SinoFrench Engineer School Nanjing University of Science and Technology 2.Heilongjiang North Tool Co. Ltd. 3.School of Mechanical Engineering Nanjing University of Science and Technology 4.School of Materials Science and Engineering Nanjing University of Science and Technology

KeyWords： Cu/Al composite plate deep drawing cups testing Erichsen cupping test mechanical anisotropy behavior interfacial bonding strength

ClassificationCode：TB331

year,vol(issue):pagenumber：2023,48(7):82-92

Abstract：

In order to meet the needs of intelligent manufacturing and lightweight ammunition, Cu/Al composite plate with the thickness ratios of 1∶1, 1∶5 and 1∶9 were prepared by cold rolling method, and the influences of thickness ratio on stamping properties and interfacial bonding strength of composite plates were studied. Then, the basic mechanical properties and anisotropy parameters of materials were obtained by uniaxial tensile tests, and the stamping properties of Cu/Al composite plate were quantitatively characterized by the deep drawing cups testing and Erichsen cupping test. Furthermore, the influences of annealing temperature on the mechanical anisotropy behavior and interfacial bonding strength of composite plates were studied to regulate the stamping properties of composite plate. The results show that the quality of stamping parts for three kinds of Cu/Al composite plates is good, and the higher the thickness ratio of copper layer is, the better the stamping properties of composite plate are. After annealing at 500 ℃/120 min, the mechanical anisotropy parameter of plate reaches the lowest value of 0.027, and the stamping properties is significantly improved. As the annealing temperature increases, the thickness of diffusion layer gradually increases, and the interfacial bonding strength first increases and then decreases. Thus, the research results con provide the theoretical guidance for the preparation of Cu/Al composite plates with excellent stamping properties.

Funds：

国家自然科学基金资助项目（51901101，11802131）

作者简介：陈才（1985-），男，博士，讲师 E-mail：cai.chen@njust.edu.cn

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