Transactions of Materials and Heat Treatment

Title：Microstructure and properties of CuCrSnZnSi copper alloy for lead frames

Authors： Liu Xiaobin1 Zhang Yansong1 Wang Ruolan1 Feng Hongwei1 Deng Lixun1 Wu Zheng1 Gong Liukui1 2 Huang Wei1

Unit： 1.Ningbo Branch of Chinese Academy of Ordnance Science 2.Ningbo Surface Engineering Research Institute Co. Ltd.

KeyWords： CuCrSnZnSi copper alloy tensile strength conductivity microstructure strengthening mechanism

ClassificationCode：TG146.1

year,vol(issue):pagenumber：2024,49(8):205-213

Abstract：

The microstructure and strengthening mechanism of Cu-0.2Cr-0.252Sn-0.166Zn-0.014Si alloy were studied using SEM, EBSD, XRD, TEM as well as mechanical and electrical performance testing methods. The results show that the tensile strength, yield strength, microhardness, elongation after fracture and conductivity of as-cast Cu-0.2Cr-0.252Sn-0.166Zn-0.014Si alloy after hot rolling+water cooling, cold rolling aging, cold rolling and annealing treatment are 483 MPa, 452 MPa, 178.0 HV0.2, 9% and 69.6%IACS, respectively. The average grain size of the alloy after annealing treatment is about 1.20 μm. The local strain is relatively high, with a grain dislocation angle of 17.15° and a strong preferred orientation, mainly characterized by Goss texture ({110}<001>) and Copper texture ({112}<11-1>). The elements Sn and Zn are dispersed in the matrix in a solid solution form, while the element Cr is distributed in the matrix in a nano phase form, the grain boundary strengthening is the main strengthening mechanism of annealed Cu-0.2Cr-0.252Sn-0.166Zn-0.014Si alloy, with relatively weaker element Cr nanoprecipitation strengthening, elements Sn and Zn solid solution strengthening and dislocation strengthening.

Funds：

宁波市重点研发计划(2023Z096,2023Z092)；宁波市科技创新2025重大专项(2019B10083)

作者简介：刘晓彬(1987-)，女，硕士，副研究员 E-mail：47995715@qq.com 通信作者：黄伟(1981-)，男，博士，研究员 E-mail：hw315@126.com

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