Transactions of Materials and Heat Treatment

Title：Effect of roller diameter on surface microscopic defects and properties of Cu-Fe-P copper alloy rolled strip

Authors： Zhang Bin Guo Yuhui Yang Xiaoping Wang Manfeng Liu Fei Jing Linqi Ma Jianyang Yuan Xiaolei

Unit：（Taiyuan Jinxi Chunlei Copper Co. Ltd. Taiyuan 030008 China）

KeyWords： Cu-Fe-P copper alloy roller diameter strain rate micro pit electroplate

ClassificationCode：TG339

year,vol(issue):pagenumber：2024,49(9):122-128

Abstract：

To explore the generation mechanism of microscopic defects on the surface of metal strip used as the frame material for integrated circuit, the relationship between strain rate and roller diameter during the strip rolling process was established, and four types of rollers with different diameters were selected

to roll the Cu-Fe-P copper alloy strips. Then, the number and state of micro pits on the surface of rolled strip were analyzed, and the tensile strength, elongation and microhardness were detected. In addition, electroplating Ni experiments were conducted on the rolled strips, and the surface defect changes before and after electroplating were detected by energy dispersive spectroscopy. The results show that with the increasing of roller diameter, the strain rate of rolled strip decreases, the micro pits on the surface of strip significantly decreases, and the tensile strength decreases, but the fluctuation value of tensile strength increases. After surface electroplating, the micro pits on the surface of strip are not covered by the coating. Thus, the micro pits on the surface of rolled strip by the roller with Φ210 mm are minimized, which can provide reference for the optimization of rolling process and the improvement of the surface quality of Cu-Fe-P copper alloy strip.

Funds：

作者简介：张斌（1981-），男，硕士，高级工程师 E-mail：jxclzb@163.com

Reference：

\[1］刘凯，齐亮，谢春晓,等. IC引线框架材料概述\[J］. 热处理，2005，21(2)：21-24.

Liu K, Qi L, Xie C X, et al. Summarization on the materials for IC lead frame\[J］. Heat Treatment, 2005, 21(2): 21-24.

\[2］刘喜波，董企铭，刘平,等. 引线框架材料Cu-Fe-P合金试制产品分析\[J］. 铸造，2004，53(9)：736-738.

Liu X B, Dong Q M, Liu P, et al. Analysis on Cu-Fe-P alloy trial production for lead frame materials\[J］. Foundry, 2004, 53(9): 736-738.

\[3］师阿维. 引线框架用铜合金的研究与发展\[J］. 热处理，2006，22(2)：6-10.

Shi A W.Research and development of copper alloys for lead frame\[J］. Heat Treatment, 2006, 22(2):6-10.

\[4］ Peter Van Zant.芯片制造－半导体工艺制程实用教程 \[M］. 韩郑生，赵树武，译. 北京：电子工业出版社，2010.

Peter Van Zant. Microchip Fabrication: A Practical Guide to Semiconductor Processing \[M］. Translated by Han Z S, Zhao S W. Beijing: Publishing House of Electronics Industry, 2010.

\[5］高铭余，谢宏斌，方攸同,等. 铜及铜合金表面处理技术进展\[J］. 中国有色金属学报，2021，31(5)：1121-1133.

Gao M Y, Xie H B, Fang Y T, et al. Progress in surface treatment techniques of copper and copper alloys\[J］. The Chinese Journal of Nonferrous Metals, 2021, 31(5): 1121-1133.

\[6］李维创，尹柏强. 工业金属板带材表面缺陷自动视觉检测研究进展 \[J］. 电子测量与仪器学报，2021，35(6)：1-16.

Li W C, Yin B Q. Research progress of automated visual surface defect detection for industrial metal planar materials\[J］. Journal of Electronic Measurement and Instrumentation, 2021, 35(6): 1-16.

\[7］涂思京，闫晓东，谢水生. 引线框架用铜合金C194的组织性能研究 \[J］. 稀有金属，2003，28(1)：199-201.

Tu S J, Yan X D, Xie S S. Structure and performance of C194 copper alloy used for lead frame \[J］. Rare Metals, 2003, 28(1): 199-201.

\[8］吕官丽. 引线框架用C19400合金微结构特征和抗软化性能\[D］. 洛阳：河南科技大学，2022.

Lyu G L. Microstructural Characteristics and Softening Resistance of C19400 Alloy for Lead Frames \[D］. Luoyang: Henan University of Science and Technology, 2022.

\[9］ Xu J, Guan B, Fu R, et al. Tailoring the microstructure and mechanical properties of CuFe alloy by varying the rolling path and rolling temperature\[J］.Journal of Materials Research and Technology, 2023, 27: 182-193.

\[10］张佳康，周晓敏，蒋靖. 冷轧带钢表面微观形貌轧制转印规律分析\[J］. 金属世界，2018(3)：34-39.

Zhang J K，Zhou X M，Jiang J. Analysis of rolling transfer law of surface micromorphology of cold-rolled strip steel\[J］. Metal World，2018(3):34-39.

\[11］Yang J Z, Bu K, Zhou Y J, et al. Influence of short-time annealing on the evolution of the microstructure, mechanical properties and residual stress of the C19400 alloy strips\[J］. Journal of Alloys and Compounds, 2023, 941：168705.

\[12］张丹丹. C19400铜合金板带冷轧变形规律与性能研究\[D］. 洛阳：河南科技大学，2020.

Zhang D D. Study on Cold Rolling Deformation and Properties of C19400 Copper Alloy Strip\[D］. Luoyang：Henan University of Science and Technology, 2020.

\[13］Aman G, Lalit K, Tae-Hyeon Y, et al. Unveiling the self-annealing phenomenon and texture evolution in room-temperature-rolled Cu-Fe-P alloy sheets\[J］. International Journal of Plasticity, 2022, 159：103473.

\[14］李六军，李习周，郭昌宏. 引线框架表面缺陷与解决方法浅析\[J］. 中国集成电路，2021，30(8)：74-79.

Li L J, Li X Z, Guo C H. Abnormalities of lead frame surface and solutions\[J］. China lntegrated Circult, 2021, 30(8): 74-79.

\[15］Reiner K，Herbert W. 金属塑性成形导论 \[M］. 康永林，洪慧平，译.北京：高等教育出版社，2009.

Reiner K, Herbert W. Einführung in Die Umformtechnik \[M］. Translated by Kang Y L, Hong H P. Beiiing：Higher Education Press, 2009.

\[16］孙建林. 轧制工艺润滑原理、技术与应用 \[M］. 北京：冶金工业出版社，2010.

Sun J L. Principle Technology and Application of Lubrication in Rolling Process \[M］. Beijing: Metallurgical Industry Press, 2010.

Service：

【This site has not yet opened Download Service】【Add Favorite】