Transactions of Materials and Heat Treatment

Title：Prediction on riveting strength of relay wafer and optimization of process parameters

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ClassificationCode：TG316

year,vol(issue):pagenumber：2025,50(1):165-175

Abstract：

For riveting the armature and moveable spring, the detachment entire process of riveting and riveted parts were numerically simulated by finite element software DEFORM-3D, and the finite element models of the riveting process between the armature and moveable spring and the detachment process of riveted part were established. Then, the influence laws of extrusion stroke and expansion degree on riveting strength were analyzed. A comparative analysis was conducted by combining the numerical analysis and experimental research on riveting. Furthermore, the relationship between the extrusion stroke and the critical load was given, and the riveting process parameters were optimized. The analysis results show that there are two main forms of riveted part failure, such as rivet root fracture and rivet head detachment from the moveable spring. When the extrusion stroke is 0.75 mm, the critical load of the riveted parts is the highest. When the extrusion stroke is higher than 0.75 mm, the deformation occurs in the rivet root resulting in the detachment. However, the riveting strength is good when the extrusion stroke is 0.63-0.75 mm, and the lower limit of the extrusion stroke is 0.63 mm. Thus, the service life of riveted parts is significantly improved.

Funds：

福建省产学重大项目（2023H6015）

作者简介：张传忠（1976-），男，学士，高级工程师 E-mail：13861175963@163.com

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